A heat dissipation simulator of a component on a printed circuit board (PCB) includes a simulation board and a simulated heat source. The simulation board includes an iron layer and a plastic layer. The simulated heat source includes a simulation chip, a thermal, and a heat sink. The simulation chip, the thermal piece, and the heat sink are mounted on the simulation board in that order. The heat dissipation simulator replaces a sample of the PCB with the component for simulating working states of the component on the PCB.

当设计人员初步设计好一电路板的结构后，需先进行散热测试，以判断该电路板上的主要发热元件是否符合散热要求，以使这些电子元件能正常的工作。若这些电子元件的散热要求不能满足要求，此时设计人员就必须对该电路板的结构进行修改，然后再进行散热测试直到满足这些电子元件的散热要求为止。